Sputtering rate and stability
Deposition rate: In DC magnetron sputtering (Ar gas pressure 0.5 Pa, power density 3 W/cm²), the deposition rate of niobium targets can reach 10-15 nm/min, which is comparable to tantalum (12-18 nm/min) and higher than titanium (6-8 nm/min).
Stability: After 100 hours of continuous sputtering, the rate fluctuation is <3%, which is better than zinc (fluctuation >10%).
Film quality
Crystal orientation: By adjusting the substrate temperature (such as 400°C), preferential growth in the (110) crystal orientation can be achieved, improving the conductivity of the film (resistivity reduced to 15 μΩ·cm).
Surface roughness: Sputtered niobium film Ra <0.5 nm, meeting the requirements of optical reflectors (such as laser resonators).
Zhenan Niobium Target Product Picture Display
